Effect of Al-trace degradation on Joule heating during...

Applied Physics Letters 2007 Vol. 90; Iss. 8

Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints

Liang, S. W., Chiu, S. H., Chen, Chih
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Volume:
90
Year:
2007
Language:
english
Journal:
Applied Physics Letters
DOI:
10.1063/1.2644061
File:
PDF, 552 KB
english, 2007
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