![](/img/cover-not-exists.png)
[IEEE 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Seattle, WA, USA (25-28 May 1998)] 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Computational simulation of underfill encapsulation of flip-chip ICs. I. Flow modeling and surface-tension effects
Yang, H., Bayyuk, S., Krishnan, A., Przekwas, A., Nguyen, L., Fine, P.Year:
1998
Language:
english
DOI:
10.1109/ectc.1998.678912
File:
PDF, 813 KB
english, 1998