Study of Curing Kinetics of an Epoxy-Amine Adhesive System...

Polymer-Plastics Technology and Engineering 2008 / 10 Vol. 47; Iss. 11

Study of Curing Kinetics of an Epoxy-Amine Adhesive System Using a Calorimetric Analysis Approach

Guo, Xiaoping
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
47
Language:
english
Journal:
Polymer-Plastics Technology and Engineering
DOI:
10.1080/03602550802391391
Date:
October, 2008
File:
PDF, 602 KB
english, 2008
Conversion to is in progress
Conversion to is failed