[IEEE 2014 International Conference on Electronics...

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[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - High-performance cooling system with multi-channel electro-osmotic flow pumps for high-power 3D-ICs

Kudo, H., Yonekawa, T., Yoshimi, S., Oguri, Y., Tsukune, A., Kim, Y. S., Kitada, H., Fjimoto, K., Kinefuchi, I., Matsumoto, Y., Ohba, T.
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Year:
2014
Language:
english
DOI:
10.1109/icep.2014.6826725
File:
PDF, 690 KB
english, 2014
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