[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Determining parameter of solder joint defect characterization based on correlation analysis
Huang ChunYue,, Wang Wangang,, Liang Ying,, Li Tianming,Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582626
File:
PDF, 651 KB
english, 2010