[IEEE ICVC'99. 6th International Conference on VLSI and CAD - Seoul, South Korea (26-27 Oct. 1999)] ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361) - Profile simulation and stress analysis for optimization of an intermetal dielectric deposition (IMD) process
Tai-Kyung Kim,, Won-Young Chung,, Hong-Jae Shin,, Jai-Jun Oh,, Jai-Kwang Shin,, Jeoung-Taek Kong,Year:
1999
Language:
english
DOI:
10.1109/icvc.1999.820822
File:
PDF, 299 KB
english, 1999