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[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - Mechanical and electrical evaluation of a bumped-substrate die-level burn-in carrier
Thompson, P., Begay, M., Lindsey, S., Vanoverloop, D., Vasquez, B., Walker, S., Williams, B.Year:
1994
Language:
english
DOI:
10.1109/ectc.1994.367594
File:
PDF, 409 KB
english, 1994