[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Mid-process through silicon vias technology using tungsten metallization: Process optimazation and electrical results
Pares, G., Minoret, S., Lugand, J F., Huet, S., Lapras, V., Anciant, R., Henry, D., Sillon, N., Dunne, B.Year:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416444
File:
PDF, 848 KB
english, 2009