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[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests
Pufall, R., Goroll, M., Mahler, J., Kanert, W., Bouazza, M., Wittler, O., Dudek, R.Year:
2011
Language:
english
DOI:
10.1109/esime.2011.5765786
File:
PDF, 1.91 MB
english, 2011