[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Solder volume effects on fatigue life of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu interconnects

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