Ultrasonic-Assisted Thermocompression Bonding Method of...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 12 Vol. 3; Iss. 12

Ultrasonic-Assisted Thermocompression Bonding Method of Solder Anisotropic Conductive Film Joints for Reliable Camera Module Packaging

Kim, Yoo-Sun, Kim, Seung-Ho, Lee, Kiwon, Paik, Kyung-Wook
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2283888
Date:
December, 2013
File:
PDF, 1.75 MB
english, 2013
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