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[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Premold on Substrate for MEMS Package
Wang, Meng-Jen, Yang, Kuo-Bin, Peng, Sheng-Yang, Hsiao, Wei-Min, Wang, Feng-Yan, Wang, Wei-ChungYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.374019
File:
PDF, 3.06 MB
english, 2007