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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Dynamic current characteristic of ultrasonic transducer for wire bonding
Zou, Changhui, Wang, Fuliang, Qiao, JiapingYear:
2010
Language:
english
DOI:
10.1109/icept.2010.5582666
File:
PDF, 986 KB
english, 2010