[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - High thermal performance FBGA MCP with a silicon spacer
Joonghyun Baek,, Heejin Lee,, Sangwook Park,, Haehyung Lee,, Dongho Lee,, Seyong Oh,Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/ectc.2005.1441367
File:
PDF, 938 KB
english, 2005