[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Polymer Flip Chip Bumping and Its Application for CdZnTe Detectors
Xue, Lin, Cai, Jian, Lu, Lei, Zhang, Lan, Wang, ShuidiYear:
2006
Language:
english
DOI:
10.1109/icept.2006.359790
File:
PDF, 5.76 MB
english, 2006