IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1995 / Aug. Vol. 18; Iss. 3
Design of 0.35-mm pitch QFP lead and its assembly technology
Totani, M., Teshima, Y., Ito, N., Nagatake, M., Otaguro, H.Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.404103
Date:
January, 1995
File:
PDF, 646 KB
english, 1995