[IEEE 2014 International Conference on Electronics...

  • Main
  • [IEEE 2014 International Conference on...

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Effects of bump height and UBM structure on the reliability performance of 60µm-pitch solder micro bump interconections

Yu-Wei Huang,, Chau-Jie Zhan,, Lin Yu-Min,, Jing-Ye Juang,, Shin-Yi Huang,, Su-Mei Chen,, Chia-Wen Fan,, Ren-Shin Cheng,, Shu-Han Chao,, Lin, C. K., Jie-An Lin,, Chen, Chih
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2014
Language:
english
DOI:
10.1109/icep.2014.6826753
File:
PDF, 2.68 MB
english, 2014
Conversion to is in progress
Conversion to is failed