![](/img/cover-not-exists.png)
[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Effects of bump height and UBM structure on the reliability performance of 60µm-pitch solder micro bump interconections
Yu-Wei Huang,, Chau-Jie Zhan,, Lin Yu-Min,, Jing-Ye Juang,, Shin-Yi Huang,, Su-Mei Chen,, Chia-Wen Fan,, Ren-Shin Cheng,, Shu-Han Chao,, Lin, C. K., Jie-An Lin,, Chen, ChihYear:
2014
Language:
english
DOI:
10.1109/icep.2014.6826753
File:
PDF, 2.68 MB
english, 2014