[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed
Song, Fubin, Lee, S. W. Ricky, Newman, Keith, Sykes, Bob, Clark, StephenYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.373994
File:
PDF, 6.99 MB
english, 2007