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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Effective Acquisitions of Plastic, Creep, Viscoplastic Parameters of Solder Using the Stress Relaxation Method
Tanimura, Toshinobu, Yu, Qiang, Sibutani, Tadahiro, Jin, Jae-Chul, Shiratori, MasakiYear:
2006
Language:
english
DOI:
10.1109/emap.2006.4430696
File:
PDF, 3.17 MB
english, 2006