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[IEEE 30th Annual Proceedings Reliability Physics 1992 - San Diego, CA, USA (1992.03.31-1992.04.2)] 30th Annual Proceedings Reliability Physics 1992 - Comparison of delamination effects between temperature cycling test and highly accelerated stress test, in plastic packaged devices
van Gestel, R., de Zeeuw, K., van Gemert, L., Bagerman, E.Year:
1992
DOI:
10.1109/relphy.1992.187643
File:
PDF, 728 KB
1992