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[IEEE 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Seattle, WA, USA (25-28 May 1998)] 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Intermetallic compound growth on Ni, Au/Ni, and Pd/Ni substrates with Sn/Pb, Sn/Ag, and Sn solders [PWBs]
Blair, H.D., Tsung-Yu Pan,, Nicholson, J.M.Year:
1998
Language:
english
DOI:
10.1109/ectc.1998.678704
File:
PDF, 1.54 MB
english, 1998