Fabrication of high aspect ratio through-wafer copper interconnects by reverse pulse electroplating
Gu, Changdong, Xu, Hui, Zhang, Tong-YiVolume:
19
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/19/6/065011
Date:
June, 2009
File:
PDF, 1.81 MB
english, 2009