Fabrication of high aspect ratio through-wafer copper...

Fabrication of high aspect ratio through-wafer copper interconnects by reverse pulse electroplating

Gu, Changdong, Xu, Hui, Zhang, Tong-Yi
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Volume:
19
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/19/6/065011
Date:
June, 2009
File:
PDF, 1.81 MB
english, 2009
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