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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Development and thermo-mechanical stress analysis of TSVs filling with Sn-based intermetallics
He, Ran, Song, Chongshen, Dai, Fengwei, Wang, Hong, Yu, DaquanYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474563
File:
PDF, 1.21 MB
english, 2012