[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Using a combination of C-AFM and SCM for failure analysis of SRAM leakage in CMOS process with the addition of a DNW module
Lin, Hung Sung, Shu, Wen ChengYear:
2009
Language:
english
DOI:
10.1109/ipfa.2009.5232704
File:
PDF, 8.16 MB
english, 2009