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[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - The experimental and theoretical approaches of contraction stress build-up of anisotropic conductive adhesives for flip chip interconnection
Woon-Seong Kwon,, Se-Young Yang,, Soon-Bok Lee,, Kyung-Wook Paik,Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/ectc.2005.1441980
File:
PDF, 655 KB
english, 2005