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[IEEE 2005 International Conference on Asian Green Electronics - Shanghai, China (15-18 March 2005)] Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. - Quantitative reliability estimation of surface mount solder joints for reflow optimization
Bo Tao,, Yiping Wu,, Han Ding,, Xiong, Y.L.Year:
2005
Language:
english
DOI:
10.1109/agec.2005.1452338
File:
PDF, 778 KB
english, 2005