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[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish
Wei-Chen Luo,, Kao, C.R.Year:
2002
Language:
english
DOI:
10.1109/emap.2002.1188860
File:
PDF, 519 KB
english, 2002