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[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Moisture Transport and its Effects on Fracture Strength and Dielectric Constant of Underfill Materials
Lu, Kuan H., Chao, Brook, Luo, Zhiquan, Zhang, Lijuan, Shi, Hualiang, Im, Jay, Ho, Paul S., Li Li,, Ahmad, MudasirYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.373925
File:
PDF, 3.20 MB
english, 2007