IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1995 / 5 Vol. 18; Iss. 2
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Development of conductive adhesive joining for surface-mounting electronics manufacturing
Johan Liu,, Ljungkrona, L., Zonghe Lai,Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.386267
Date:
May, 1995
File:
PDF, 805 KB
english, 1995