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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - The Influence of Power/Ground Resonance to Via's SSN Noise Coupling in Multilayer Package and Three Mitigating Ways
Wang, Xiao-Xiao, Su, Dong-LinYear:
2006
Language:
english
DOI:
10.1109/emap.2006.4430647
File:
PDF, 2.41 MB
english, 2006