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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Process Development and Reliability Evaluation of Electrically Conductive Adhesives (ECA) For Low Temperature SMT Assembly
Lee, Jenson, Sjoberg, Jonas, Rooney, Daniel T., Geiger, David A., Shangguan, DongkaiYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763609
File:
PDF, 4.15 MB
english, 2008