[IEEE Proceedings of the IEEE 2006 International...

  • Main
  • [IEEE Proceedings of the IEEE 2006...

[IEEE Proceedings of the IEEE 2006 International Interconnect Technology Conference - Burlingame, CA (2006.06.5-2006.06.7)] 2006 International Interconnect Technology Conference - Robust Low-k Diffusion Barrier (k=3.5) for 45-nm Node Low-k (k=2.3)/Cu Integration

Yoneda, K., Kato, M., Nakao, S., Matsuki, N., Matsushita, K., Ohara, N., Kaneko, S., Fukazawa, A., Kamigaki, Y., Kobayashi, N.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2006
Language:
english
DOI:
10.1109/iitc.2006.1648683
File:
PDF, 1.41 MB
english, 2006
Conversion to is in progress
Conversion to is failed