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[IEEE Proceedings of the IEEE 2006 International Interconnect Technology Conference - Burlingame, CA (2006.06.5-2006.06.7)] 2006 International Interconnect Technology Conference - Robust Low-k Diffusion Barrier (k=3.5) for 45-nm Node Low-k (k=2.3)/Cu Integration
Yoneda, K., Kato, M., Nakao, S., Matsuki, N., Matsushita, K., Ohara, N., Kaneko, S., Fukazawa, A., Kamigaki, Y., Kobayashi, N.Year:
2006
Language:
english
DOI:
10.1109/iitc.2006.1648683
File:
PDF, 1.41 MB
english, 2006