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[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Synthesis and Application of Novel Lead-Free Solders Derived from Sn-based Nanopowders
Hsiao, Li-Yin, Chiou, Guo-Jyun, Duh, Jenq-Gong, Tsai, Su-YuehYear:
2006
Language:
english
DOI:
10.1109/icept.2006.359652
File:
PDF, 7.40 MB
english, 2006