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[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Chip Scale Module Package for WLAN Module Application
Liu, Kai, Frye, Robert C., Guruprasad, Badakere, Chelvam, Marimuthu P., Dunlap, Brett, Gongora, EricYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.373979
File:
PDF, 5.23 MB
english, 2007