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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Design, fabrication, and calibration of stress sensors embedded in a TSV interposer in a 300mm wafer
Tzeng, Pei-Jer, Lau, John H., Dai, Ming-Ji, Wu, Sheng-Tsai, Chien, Heng-Chieh, Chao, Yu-Lin, Chen, Chien-Chou, Chen, Shang-Chun, Wu, Chien-Ying, Lee, Ching-Kuan, Zhan, Chau-Jie, Chen, Jui-Chin, Hsu, YYear:
2012
Language:
english
DOI:
10.1109/ectc.2012.6249071
File:
PDF, 2.49 MB
english, 2012