IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1995 / 5 Vol. 18; Iss. 2
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Thick-film resistor/dielectric interactions in a low temperature co-fired ceramic package
Sutterlin, R.C., Dayton, G.O., Biggers, J.V.Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.386272
Date:
May, 1995
File:
PDF, 782 KB
english, 1995