[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Comparison among individual thermal cycling, vibration test and the combined test for the life estimation of electronic components
Chen, Y. S., Lee, Yang-Sin, Lin, Yu-ChengYear:
2011
Language:
english
DOI:
10.1109/impact.2011.6117152
File:
PDF, 838 KB
english, 2011