[IEEE 8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium - Baveno, Italy (7-9 May 1990)] 8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium - A new method of metal-ceramic joining for advanced microelectronic packaging
Keusseyan, R.L., Goeller, P.T., Page, J.P., Osborne, J.J., Nebe, W.J., Polzer, E.K.Year:
1990
DOI:
10.1109/iemt8.1990.171103
File:
PDF, 482 KB
1990