Application of CFD technology to electronic thermal...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1995 / Aug. Vol. 18; Iss. 3

Application of CFD technology to electronic thermal management

Lee, T.-Y.T.L., Chambers, B., Mahalingam, M.
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Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.404110
Date:
January, 1995
File:
PDF, 966 KB
english, 1995
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