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[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Two-layered thin carrier-attached copper foil
Yi-Ling Lo,, Yu-Chung Chen,, Hung-Kun Lee,, Shu-Yuan Lo,, Tzu-Ping Cheng,Year:
2012
Language:
english
DOI:
10.1109/impact.2012.6420242
File:
PDF, 847 KB
english, 2012