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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - 2N Au wire bonding for ultra fine picth BGA
Leng, Eu Poh, Yong, C.C., Siong, Chin Teck, Masahiro, Tsuriya, Vo, Nick, Seong, Lee Boon, Faizal, Zul-Kifli Mohd, Sazilawati, FadzliYear:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416499
File:
PDF, 883 KB
english, 2009