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[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Thermal cycling reliability of Cu/SnAg double-bump flip-chip assemblies for 100um pitch applications
Ho-Young Son,, Il-Ho Kim,, Soon-Bok Lee,, Gi-Jo Jung,, Byung-Jin Park,, Kyung-Wook Paik,Year:
2007
Language:
english
DOI:
10.1109/emap.2007.4510312
File:
PDF, 2.49 MB
english, 2007