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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC 2010) - Berlin (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Board level validation for green IC packaging with strain-controllable dynamic bending method
Lee, J C, Chi-Ko Yu,, Chang, G, Tina Shao,, Cherie Chen,, Xiang-Kai Meng,, Brown, MYear:
2010
Language:
english
DOI:
10.1109/estc.2010.5642869
File:
PDF, 2.48 MB
english, 2010