[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - Flip chip interconnects with electroplated, extended eutectic solder
Glezen, J.H., Naseem, H.A., Fritsch, I., Ulrich, R.K., Brown, W.D., Schaper, L.W.Year:
1998
Language:
english
DOI:
10.1109/icmcm.1998.670801
File:
PDF, 537 KB
english, 1998