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[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Mechanism exploration on Cu interconnect negative resistance shift during stress migration
XiangFu Zhao,, Dulin Wang,, Gan, Howard, Zheng, Kevin, Wu, Jeff, Venson Chang,, Wei-Ting Kary Chien,Year:
2014
Language:
english
DOI:
10.1109/irps.2014.6861150
File:
PDF, 337 KB
english, 2014