[IEEE 2014 IEEE International Reliability Physics Symposium...

  • Main
  • [IEEE 2014 IEEE International...

[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Mechanism exploration on Cu interconnect negative resistance shift during stress migration

XiangFu Zhao,, Dulin Wang,, Gan, Howard, Zheng, Kevin, Wu, Jeff, Venson Chang,, Wei-Ting Kary Chien,
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2014
Language:
english
DOI:
10.1109/irps.2014.6861150
File:
PDF, 337 KB
english, 2014
Conversion to is in progress
Conversion to is failed