Cost-effective multichip module manufacture using passive...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1997 / Aug. Vol. 20; Iss. 3

Cost-effective multichip module manufacture using passive substrate fault tolerance

Peacock, C., Bolouri, H., Habiger, C.
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Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.618232
Date:
January, 1997
File:
PDF, 172 KB
english, 1997
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