IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1997 / Aug. Vol. 20; Iss. 3
![](/img/cover-not-exists.png)
Cost-effective multichip module manufacture using passive substrate fault tolerance
Peacock, C., Bolouri, H., Habiger, C.Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.618232
Date:
January, 1997
File:
PDF, 172 KB
english, 1997