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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Damage pre-cursor based life prediction of the effect of mean temperature of thermal cycle on the SnAgCu solder joint reliability
Lall, Pradeep, Mirza, Kazi, Suhling, JeffYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897409
File:
PDF, 3.49 MB
english, 2014