[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Influence of Ni-Sn-Cu ternary intermetallic compound on solder joint reliability
Tu, Yunhua, Liu, Sang, Ye, Yuming, Chen, LiminYear:
2006
Language:
english
DOI:
10.1109/emap.2006.4430698
File:
PDF, 9.45 MB
english, 2006