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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Underfills for lead-free and low-k flip chip packages
Qing Ji,, Renzhe Zhao,, Qiaohong Huang,, Pukun Zhu,Year:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074267
File:
PDF, 3.52 MB
english, 2009