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[IEEE 2012 IEEE Sensors - Taipei, Taiwan (2012.10.28-2012.10.31)] 2012 IEEE Sensors - Bulk-Si with poly bump process scheme for MEMS sensors
Cheng, Chun-Wen, Liang, Kai-Chih, Chu, Chia-Hua, Lee, Te-Hao, Lee, Jiou-Kang, Lin, Chung-Hsien, Tuan, Hsiao Chin, Kalnitsky, Alex, Fang, Weileun, Horsley, David A.Year:
2012
Language:
english
DOI:
10.1109/icsens.2012.6411212
File:
PDF, 1.07 MB
english, 2012